Fused Silica

OHARA synthetic fused silica is produced by vapor-phase axial deposition and provides ultra-pure, bubble free material. 

Fused Silica

MethodMaterialCharacteristicsApplicationStandard size
Fused Silica

SK-1300 Series

SK-1300

SK-1310

SK-1320

  • The VAD method developed for optical fiber has been further improved to manufacture fused silica.
  • Unparalleled, ideal characteristics are achieved.
    • Ultra-high purity (total metallic impurities less than 0.5ppm)
    • The OH content can be controlled to 1 ppm or less.
    • High heat resistance is ensured.
    • High transmission is achieved. (The SK-1310 has excellent
      characteristics over the entire wavelength range of ultraviolet, visible, and infrared.)
    • Contains no bubbles or striae.
    • Excellent laser resistance properties
  • Wafers for various types of devices such as TFT (poly-si thin-film transistor LCD), SOI (Silicon on Insulator) etc.
  • Photomask substrates for ultra-LSI and LCD.
  • Optical elements, lenses, mirrors and windows for ultraviolet and vacuum ultraviolet.

[Plates]

  • 50~ 500mm round
  • 50~ 1000mm square